1. REPOSITORY UNIVERSITAS MEDAN AREA

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Issue DateTitleAuthor(s)
2016-03-20Fluid Structre Interaction Numerical Simulation of Wiresweep in Electronics PackagingRamdan, Dadan; Harahap, Usman; Rubiantara, Andi; Khor, Chu Yee
2017Influence of Number Of Mold Cavity Vents on Wire Sweep in PBGA Encapsulation: FSI-MpCCI SimulationRamdan, Dadan; Darianto; Khor, Chu Yee; Abdillah, Mohd. Zulkifli
2016Optimization of PBGA Encapsulation Considering Fluid/Structure Interaction Using Response Surface MethodologyRamdan, Dadan; Darianto; Khor, Chu Yee

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