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| Issue Date | Title | Author(s) | ???itemlist.dc.contributor.advisor??? |
|---|---|---|---|
| 2022 | Optimalisasi Perancangan Paket Plastic Ball Grid Array (PBGA) Melalui Pengamatan Perilaku Fluid Structure Interaction (FSI) pada Proses Injections Molding | Ramdan, Dadan; Umroh, Bobby; Elapri, Bima Yoel; Munthe, Irwan Saputra | - |
| 2016 | Optimization of PBGA Encapsulation Considering Fluid/Structure Interaction Using Response Surface Methodology | Ramdan, Dadan; Darianto; Khor, Chu Yee | - |
| 20-Mar-2016 | Fluid Structre Interaction Numerical Simulation of Wiresweep in Electronics Packaging | Ramdan, Dadan; Harahap, Usman; Rubiantara, Andi; Khor, Chu Yee | - |
| 2017 | Influence of Number Of Mold Cavity Vents on Wire Sweep in PBGA Encapsulation: FSI-MpCCI Simulation | Ramdan, Dadan; Darianto; Khor, Chu Yee; Abdillah, Mohd. Zulkifli | - |
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